Zhaoyi Innovation launches GD32VW553 series Wi Fi 6 MCU

GigaDevice (stock code 603986), a leading semiconductor device supplier in the industry, announced today the official launch of the GD32VW553 series dual-mode wireless microcontroller based on the RISC-V core.

The GD32VW553 series MCU supports Wi Fi 6 and Bluetooth LE 5.2 wireless connections. With advanced RF integration, enhanced security mechanisms, large storage resources, and rich universal interfaces, combined with mature process platforms and optimized cost control, it continuously provides solutions for market applications that require efficient wireless transmission. The new product portfolio offers 8 models and two small package options, QFN40/QFN32. Sample and development board applications are now open and will be officially available for mass production and supply in December.

With excellent edge processing and connectivity features, GD32VW553 can be applied to various wireless application scenarios such as smart home appliances, smart homes, industrial interconnection, and communication gateways. Focusing on the need for low development budgets, this series of MCUs can also be an ideal choice for office equipment, payment terminals, and various IoT products.

Jin Guangyi, Marketing Director of Zhaoyi Innovation Products, stated that the GD32VW553 series of new products, with its streamlined and optimized RISC-V open source instruction set architecture, MCU as the main controller and support for leading dual-mode wireless connection standards, meets the extensive networking needs of the booming home appliance and emerging AIoT markets, achieving a balance between processing performance, solution design, and material costs. Using a continuously expanding RF development platform to address wireless design challenges in high-density and complex environments, providing developers with a safe, reliable, energy-efficient and efficient connection experience

▲ GD32VW553 series RISC-V core dual-mode wireless MCU

Leading RF computing performance

For real-time processing and efficient communication requirements, the GD32VW553 series MCU adopts a brand new open-source instruction set architecture RISC-V processor core, with a clock speed of up to 160MHz. It is also equipped with advanced DSP hardware accelerators, double precision floating-point units (FPUs), and instruction expansion interfaces, etc. The outstanding microarchitecture design achieves excellent energy efficiency and provides flexible scalability.

The GD32VW553 series MCU integrates a 2.4GHz Wi Fi 6 RF module that adopts the IEEE 802.11ax standard and is backward compatible with the IEEE 802.11b/g/n standard, making it suitable for different network environments. Supports Orthogonal Frequency Division Multiple Access (OFDMA) to enable multiple devices to share channel resources, resulting in a 60% increase in data transmission rate compared to Wi Fi 4; It also supports multi-user multiple input multiple output (MU-MIMO), which can work together with multiple devices simultaneously without interfering with each other. Thus achieving efficient and low latency communication in high-density access scenarios with multiple devices.

The Bluetooth LE 5.2 RF module integrated on the chip can extend communication distance, improve throughput, enhance security, and save energy with the latest Bluetooth specifications. Provides 2Mbps high-speed data mode and multiple speeds of 125K/500Kbps, effectively reducing transmission time and improving sensitivity. It can also assist in building and configuring stable and fast wireless networks in numerous devices and complex environments.

The new dual-mode wireless MCU provides advanced baseband and RF performance, and includes multiple additional features. Supporting wireless coexistence protocols based on data transmission arbitration (PTA) mechanism significantly reduces co channel interference generated by Wi Fi and Bluetooth and improves signal reception stability. It also has high dynamic range automatic gain control (AGC), effectively enhancing signal quality. Thanks to the timed wake-up mechanism (TWT) of Wi Fi 6, GD32VW553 can flexibly schedule the sleep and wake-up time of devices, effectively improving energy efficiency and suitable for low-power, long-range wireless device access needs.

High integration and security assurance

The GD32VW553 series of new products integrates up to 4MB of Flash and 320KB of SRAM, as well as 32KB of configurable instruction cache (I-Cache), greatly improving CPU processing efficiency. Not only does it have excellent wireless performance, but the chip is also equipped with a variety of general-purpose wired interfaces, including 3 U (S) ART, 2 I2C, 1 SPI, and 1 four wire QSPI, as well as up to 29 programmable GPIO pins. Built in 2 32-bit universal timers, 2 16 bit universal timers, 4 16 bit basic timers, 1 PWM advanced timer, and 1 12 bit ADC. The power supply voltage is 1.8V~3.6V, and a wide temperature range of 85 ℃~105 ℃ is provided to meet the needs of high-temperature applications such as industrial control interconnection, lighting equipment, and socket panels.

GD32VW553 also has multiple security features to simplify the secure connection and management of high-performance wireless devices. Support Wi Fi Protected Access (WPA) security features, including the new WPA3 encryption technology for personal and enterprise networks. Hardware encryption and decryption support DES, triple DES, AES, and hash algorithms, as well as public key encryption and decryption (PKCAU), to ensure confidentiality and data integrity in wireless communication processes. A true random number generator (TRNG) can provide unpredictable data for generating keys for various security protocols, thereby further enhancing the security strength of the system.

▲ GD32VW553 series MCU product portfolio

Empowering wireless innovation with ecology

The RISC-V development ecosystem covering the entire process of GD32 has become increasingly sophisticated and highly compatible with the development environment and usage habits of existing MCUs, helping users quickly build competitive solutions in the market. Zhaoyi Innovation provides a free development environment GD32 IDE, debugging download tool GD-LINK, and multi in one programming tool GD32 All In One Programmer for the new GD32VW553 series microcontroller. We have also simultaneously launched an SDK and supporting development board EVB, which includes underlying drivers, wireless protocol stacks, application routines, and other functions. It is compatible with multiple real-time operating systems (RTOS) that support local, cloud connectivity, security, and over the air (OTA) upgrades, making it easy for networked terminals to deploy quickly. Compliant with the Matter over Wi Fi application standard developed by the International Organization Connectivity Standards Alliance (CSA), it supports seamless interconnection of various Matter devices using GD32VW553, improving the compatibility and interoperability of smart home systems.

SEGGER, a leading embedded development system supplier in the industry from Germany, has reached a strategic partnership with Zhaoyi Innovation to provide developers with a fully free and commercially available SEGGER Embedded Studio integrated development environment (IDE) and a complete set of development tools. The Swedish IAR will also provide comprehensive support for the GD32VW553 new MCU, including development, compilation, and trace debugging tools.

The GD32VW553 series MCU has officially passed Wi Fi 6 certification from the Wi Fi Alliance (WFA), Bluetooth certification from the Bluetooth SIG, and RF FCC/CE compliance certification. Zhaoyi Innovation is collaborating with multiple module manufacturers and developer platforms to launch "turnkey solutions" such as wireless modules and service authentication, helping embedded devices quickly connect and innovate applications, and quickly building IoT platforms and product solutions that support various wireless communications such as Wi Fi and Bluetooth.

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About GD32 MCU

Zhaoyi Innovation GD32 MCU is a leader in China's high-performance general-purpose microcontroller field and the largest Arm in China ®  MCU family, the first Arm launched in China ®  Cortex ®- M3、Cortex ®- M4、Cortex ®- M23、Cortex ®- M33 and Cortex ®- The M7 core universal MCU product series and the world's first RISC-V core universal 32-bit MCU product series have developed into the core choice of the 32-bit universal MCU market. With a cumulative shipment volume of over 1.5 billion pieces, over 20000 customers, and over 550 product choices across 44 series, our extensive application coverage remains the top in China.

Zhaoyi Innovation GD32 MCU is also Arm ® The first batch of partners in China for the University Program (AUP) Arm ®  mbed ™  IoT platform ecosystem partner, RISC-V Foundation strategic member, and the title sponsor of the "Zhaoyi Innovation Cup" China Graduate Electronic Design Competition. GD32 aims to create a blueprint for the development of an "MCU department store", providing users with the most comprehensive system level product and solution support, building an intelligent development platform and a complete product application ecosystem. For more information, please visit GD32MCU.com.

About Zhaoyi Innovation

Zhaoyi Innovation Technology Group Co., Ltd. (stock code 603986) is a leading global supplier of Fabless chips. The company was founded in April 2005 and is headquartered in Beijing, China. It has branches in multiple countries and regions around the world, and its marketing network covers the globe, providing high-quality and convenient localized support services. Zhaoyi Innovation is committed to building a complete ecosystem driven by memory, microcontrollers, sensors, and analog products, providing customers in the industrial, automotive, computing, consumer electronics, IoT, mobile applications, and communication fields with comprehensive product technology and services. It has passed ISO9001 and ISO14001 management system certifications and established strategic partnerships with multiple world-renowned wafer fabs and packaging testing plants to jointly promote technological innovation in the semiconductor field. For more information, please visit www.GigaDevice.com.